Jumper chip component and mounting structure therefor

ABSTRACT

A jumper chip component of the present invention includes a connection conductor formed of a conductive layer over an upper face and opposite side faces of an insulating substrate, and a conductive material formed of a conductive layer between plates of the insulating substrate and on a side face at the corner of the insulating substrate so as not to be electrically connected to the connection conductor. Since the conductive material formed between the plates of the insulating substrate opposes the connection conductor formed on the upper face of the insulating substrate, the connection conductor formed on the upper face of the insulating substrate and a second conductive pattern disposed under the insulating substrate are shielded from each other by the conductive material, and good isolation is possible.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a jumper chip component suitablefor use in a high-frequency device, such as a satellite receivingconverter, and to a mounting structure therefor.

[0003] 2. Description of the Related Art

[0004] A conventional jumper structure will be described with referenceto FIG. 12. A circuit board 51 on which various electrical components(not shown) are mounted is provided with a pair of first conductivepatterns 52 a and 52 b spaced from each other, and a second conductivepattern 53 extending between the pair of first conductive patterns 52 aand 52 b.

[0005] A jumper wire 54 made of a conductive wire is soldered to thefirst conductive patterns 52 a and 52 b at both ends while crossing overthe second conductive pattern 53.

[0006] Since the conventional jumper structure adopts the jumper wire54, automation of mounting operation is difficult, and productivity islow.

[0007] When the jumper wire 54 is mounted on the circuit board 51, thejumper wire 54 and the second conductive pattern 53 crossing each otheroppose and interfere with each other, which worsens isolation.

SUMMARY OF THE INVENTION

[0008] Accordingly, an object of the present invention is to provide ajumper chip component that can automate and improve mounting operationand that achieves good isolation, and a mounting structure therefor.

[0009] In order to overcome the above problems, according to a firstaspect, the present invention provides a jumper chip component includingan insulating substrate composed of a stacked rectangular plates, aconnection conductor formed of a conductive layer over an upper face andopposite side faces of the insulating substrate, and a conductivematerial formed of a conductive layer between the plates of theinsulating substrate and on a side face at a corner of the insulatingsubstrate so as not to be electrically connected to the connectionconductor, wherein the conductive material formed between the plates ofthe insulating substrate opposes the connection conductor formed on theupper face of the insulating substrate.

[0010] In this case, the connection conductor on the upper face of theinsulating substrate and the second conductive pattern placed under theinsulating substrate are shielded from each other by the conductivematerial. Consequently, interference therebetween is minimized, and goodisolation is possible.

[0011] Since the jumper member is made of a chip component, mountingthereof can be automated, and mounting operation can be improved.

[0012] Since the conductive material is formed on the side face at thecorner of the insulating substrate, it can be firmly mounted, and can besoldered to the third conductive pattern for grounding at a distancefrom the second conductive pattern. This allows flexibility in thesoldering position of the jumper chip component.

[0013] Preferably, the conductive material formed on the side face ofthe insulating substrate is formed at a plurality of corners. Thisallows firm mounting of the jumper chip component and reliablegrounding.

[0014] Preferably, the conductive material is formed at each of the fourcorners. This allows firmer mounting of the jumper chip component andmore reliable grounding.

[0015] Preferably, the conductive material is formed on the adjoiningside faces. This allows firmer mounting of the jumper chip component andmore reliable grounding.

[0016] Preferably, a cutoff portion is formed at the corner of theinsulating substrate, and the conductive material is formed on the sideface having the cutoff portion. This allows the conductive material tobe easily formed on the side face of the insulating substrate.

[0017] Preferably, the connection conductor and the conductive materialextend from the side faces and said side face, respectively, onto thelower face of the insulating substrate. In this case, the connectionconductor and the conductive material can be soldered well to theconductive patterns.

[0018] Preferably, at least three connection conductors are arrangedside by side. In this case, the center connection conductor is connectedto the conductive pattern for grounding, and interference between thehot-side connection conductors on both sides can be reduced by thecenter connection conductor for grounding.

[0019] According to another aspect, the present invention provides ajumper chip component including a rectangular insulating substrate, aconnection conductor formed of a conductive layer over an upper face andopposite side faces of the insulating substrate, a conductive materialformed of a conductive layer on a lower face of the insulating substrateand on a side face at a corner of the insulating substrate so as not tobe electrically connected to the connection conductor, and an insulatingfilm formed on the lower face of the insulating substrate so as to coverthe surface of the conductive material, wherein the conductive materialformed on the lower face of the insulating substrate opposes theconnection conductor formed on the upper face of the insulatingsubstrate.

[0020] In this case, the connection conductor on the upper face of theinsulating substrate and the second conductive pattern disposed underthe insulating substrate are shielded from each other by the conductivematerial. Consequently, interference therebetween is minimized, and goodisolation is possible.

[0021] Since the insulating film is provided, thickness reduction ispossible. Moreover, since the jumper member is made of a chip component,mounting thereof can be automated, and mounting operation is improved.

[0022] Since the conductive material is formed on the side face at thecorner of the insulating substrate, it can be firmly mounted. Moreover,the conductive material can be soldered to the third conductive patternfor grounding at a distance from the second conductive pattern, and thisallows flexibility in the soldering position of the jumper chipcomponent.

[0023] Preferably, the conductive material formed on the side face ofthe insulating substrate is formed at a plurality of corners. Thisallows firm mounting of the jumper chip component and reliablegrounding.

[0024] Preferably, the conductive material is formed at each of the fourcorners. This allows firmer mounting of the jumper chip component andmore reliable grounding.

[0025] Preferably, the conductive material is formed on the adjoiningside faces. This allows firmer mounting of the jumper chip component andmore reliable grounding.

[0026] Preferably, a cutoff portion is formed at the corner of theinsulating substrate, and the conductive material is formed on the sideface having the cutoff portion. This allows the conductive material tobe easily formed on the side face of the insulating substrate.

[0027] Preferably, the connection conductor and the conductive materialextend from the side faces and the side face, respectively, onto thelower face of the insulating substrate. In this case, the connectionconductor and the conductive material can be soldered well to theconductive patterns.

[0028] Preferably, at least three connection conductors are arrangedside by side. In this case, the center connection conductor is connectedto the conductive pattern for grounding, and interference between thehot-side connection conductors on both sides can be reduced by thecenter connection conductor for grounding.

[0029] According to a further aspect, the present invention provides amounting structure for a jumper chip component, including the abovejumper chip component, and a circuit board having a conductive pattern,wherein the conductive pattern includes a pair of first conductivepatterns spaced from each other, a second conductive pattern extendingbetween the first conductive patterns, and a third conductive patternfor grounding, and wherein the jumper chip component is placed on thecircuit board so that the lower face of the insulating substrate of thejumper chip component is positioned on the second conductive pattern,both ends of the connection conductor crossing the second conductivepattern are soldered to the pair of first conductive patterns,respectively, and the conductive material is soldered to the thirdconductive pattern.

[0030] In this case, the second conductive pattern disposed under theinsulating substrate and the connection conductor crossing the secondconductive pattern are shielded from each other by the conductivematerial that is grounded by the third conductive pattern. Consequently,interference therebetween is minimized, good isolation is possible, andthe mounting structure is suitable for use in a high-frequency device.

[0031] Preferably, a plurality of third conductive patterns areprovided, and the conductive material formed at the corner of theinsulating substrate is soldered to the corresponding third conductivepatterns. This allows reliable grounding of the conductive materials inthe mounting structure.

[0032] According to a further aspect, the present invention provides amounting structure for a jumper chip component, including the abovejumper chip component, and a circuit board on which at least three pairsfirst conductive patterns are arranged side by side, wherein threeconnection conductors are soldered to the corresponding three pairs offirst conductive patterns, and the center pair of conductive patterns ofthe three pairs of first conductive patterns are used for grounding.

[0033] In this case, the center connection conductor is connected to theconductive pattern for grounding, and interference between the hot-sideconnection conductors on both sides is reduced by the center connectionconductor for grounding.

[0034] According to a further aspect, the present invention provides amounting structure for a jumper chip component, including the abovejumper chip component, and a circuit board having a conductive pattern,wherein the conductive pattern includes a pair of first conductivepatterns spaced from each other, a second conductive pattern extendingbetween the first patterns, and a third conductive pattern forgrounding, and wherein the jumper chip component is placed on thecircuit board in a state in which the insulating film of the jumper chipcomponent is positioned on the second conductive pattern, both ends ofthe connection conductor crossing the second conductive pattern aresoldered to the pair of first conductive patterns, and the conductivematerial is soldered to the third conductive pattern.

[0035] In this case, the second conductive pattern disposed under theinsulating substrate and the connection conductor crossing the secondconductive pattern are shielded from each other by the conductivematerial grounded by the third conductive pattern. Consequently,interference therebetween is minimized, good isolation is achieved, andtherefore, the mounting structure is suitable for use in ahigh-frequency device.

[0036] Preferably, a plurality of third conductive patterns areprovided, and the conductive materials formed at the corners of theinsulating substrate are soldered to the corresponding third conductivepatterns. This allows the conductive materials to be reliably grounded.

[0037] According to a further aspect, the present invention provides amounting structure for a jumper chip component, including the abovejumper chip component, and a circuit board on which at least three pairsof first conductive patterns are arranged side by side, wherein thethree connection conductors are soldered to the corresponding threepairs of first conductive patterns, and the center pair of firstconductive patterns of the three pairs of first conductive patterns areused for grounding.

[0038] In this case, the center connection conductor is connected to theconductive pattern for grounding, and interference between the hot-sideconnection conductors on both sides is minimized by the centerconnection conductor for grounding.

[0039] Further objects, features, and advantages of the presentinvention will become apparent from the following description of thepreferred embodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0040]FIG. 1 is a perspective view of a jumper chip component accordingto a first embodiment of the present invention.

[0041]FIG. 2 is a rear perspective view of the jumper chip component.

[0042]FIG. 3 is a perspective view of the jumper chip component, asviewed from line III-III in FIG. 1.

[0043]FIG. 4 is a perspective view of a jumper chip component accordingto a second embodiment of the present invention.

[0044]FIG. 5 is a perspective view of a jumper chip component accordingto a third embodiment of the present invention.

[0045]FIG. 6 is a perspective view of a jumper chip component accordingto a fourth embodiment of the present invention.

[0046]FIG. 7 is a rear perspective view of the jumper chip component.

[0047]FIG. 8 is a perspective view showing a mounting structure for ajumper chip component according to a fifth embodiment of the presentinvention.

[0048]FIG. 9 is an exploded perspective view showing the mountingstructure for a jumper chip component.

[0049]FIG. 10 is an exploded perspective view showing a mountingstructure for a jumper chip component according to a sixth embodiment ofthe present invention.

[0050]FIG. 11 is an exploded perspective view showing a mountingstructure for a jumper chip component according to a seventh embodimentof the present invention.

[0051]FIG. 12 is a perspective view showing the principal part of aconventional jumper structure.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0052] The configuration of a jumper chip component according to a firstembodiment of the present invention will now be described with referenceto FIGS. 1 to 3. An insulating substrate A made of ceramic or the likeis composed of a plurality of stacked rectangular plates 1 and 2.

[0053] A connection conductor 3 made of a conductive layer of silver orthe like is formed over an upper face 1 a and opposite side faces 1 band 2 b of the insulating substrate A and a lower face 2 c of therectangular plate 2. Connecting portions 3 a are formed in portions ofthe side faces 1 b and 2 b and the lower face 2 c in which theconnection conductor 3 is formed.

[0054] A conductive material 4 made of a conductive layer of silver orthe like includes a shielding portion 4 a formed between the rectangularplates 1 and 2 of the insulating substrate A, cutout portions 4 b formedso as not to be electrically connected to the connecting portions 3 a ofthe connection conductor 3, and a plurality of connecting portions 4 cformed on the side faces 1 b and 2 b at four corners of the insulatingsubstrate A.

[0055] The shielding portion 4 a opposes the connection conductor 3 onthe upper face 1 a with the upper rectangular plate 1 therebetween, andthe connecting portions 4 c are formed on the side faces 1 b and 2 badjoining with the corners therebetween.

[0056] The connecting portions 4 c of the conductive material 4 extendover the upper face 1 a and the lower face 2 c of the insulatingsubstrate A.

[0057] A jumper chip component B1 of the first embodiment has the aboveconfiguration.

[0058] The configuration of a jumper chip component according to asecond embodiment of the present invention will now be described withreference to FIG. 4. In the second embodiment, arc-shaped cutoffportions 1 d are formed on opposite side faces 1 b and 2 b of aninsulating substrate A, and arc-shaped cutoff portions le are formed atfour corners of the insulating substrate A.

[0059] Connecting portions 3 a of a connection conductor 3 are formed inthe cutoff portions 1 d, and connecting portions 4 c of a conductivematerial 4 are formed in the cutoff portions le at the four corners.

[0060] Since other structures are similar to those in theabove-described first embodiment, the same components are denoted by thesame numerals, and descriptions thereof are omitted.

[0061] A jumper chip component B1 of the second embodiment has the aboveconfiguration. The connecting portions 3 a and 4 c are formed inrecesses serving as the cutoff portions 1 d and 1 e that are formed inthe large substrate, and the large substrate is then cut with referenceto the recesses, so that a desired jumper chip component can beobtained. Consequently, the connecting portions 3 a and 4 c can beformed easily.

[0062] The configuration of a jumper chip component according to a thirdembodiment of the present invention will now be described with referenceto FIG. 5. In the third embodiment, a plurality of (three in thisembodiment) connection conductors 3 are arranged side by side.

[0063] Since other structures are similar to those in theabove-described first embodiment, the same components are denoted by thesame reference numerals, and descriptions thereof are omitted.

[0064] A jumper chip component B1 of the third embodiment has the aboveconfiguration.

[0065] Of the plurality of connection conductors 3, two connectionconductors 3 on both sides are connected to hot-side conductivepatterns, and the center connection conductor 3 is connected to aconductive pattern for grounding, as will be described later.Interference between the hot-side connection conductors 3 on both sidesis reduced by the center connection conductor 3 for grounding.

[0066] In the third embodiment, cutoff portions 1 d and 1 e may beformed, as in the second embodiment shown in FIG. 2.

[0067] The configuration of a jumper chip component according to afourth embodiment of the present invention will now be described withreference to FIGS. 6 and 7. In the fourth embodiment, an insulatingsubstrate A is formed of a single-layer or multilayer rectangular plate11 of ceramic or the like.

[0068] A connection conductor 13 made of a conductive layer of silver orthe like is formed over an upper face 11 a and opposite side faces 11 bof the rectangular plate 11. Connecting portions 13 a are formed inportions of the side faces 11 b in which the connection conductor 13 isformed.

[0069] A conductive material 14 made of a conductive layer of silver orthe like includes a shielding portion 14 a formed on a lower face 11 cof the rectangular plate 11, cutout portions 14 b formed so as not to beelectrically connected to the connecting portions 13 a of the connectionconductor 13, and a plurality of connecting portions 14 c formed on theside faces 11 b of the rectangular plate 11.

[0070] The shielding portion 14 a opposes the connection conductor 13with the rectangular plate 11 therebetween, and the connecting portions14 c are formed on the side faces 11 b adjoining with the corners of therectangular plate 11.

[0071] An insulating film 12 made of an insulating material is formed onthe conductive material 14 on the lower face 11 c of the rectangularplate 11.

[0072] Such structures constitute a jumper chip component B2 of thesecond embodiment.

[0073] In the fourth embodiment, cutoff portions 1 d and 1 e may also beformed, as in the second embodiment shown in FIG. 4, and threeconnection conductors 3 may be provided, as in the third embodimentshown in FIG. 5.

[0074] The connection conductor 13 and the conductive material 14 mayextend from the side faces of the rectangular plate 11 onto the lowerface thereof.

[0075] The configuration of a mounting structure for a jumper chipcomponent according to a fifth embodiment of the present invention willnow be described with reference to FIGS. 8 and 9. A circuit board 5 onwhich various electrical components (not shown) are mounted is providedwith a pair of first conductive patterns 6 a and 6 b spaced from eachother, a second conductive pattern 7 extending between the firstconductive patterns 6 a and 6 b, and a plurality of third conductivepatterns 8 for grounding.

[0076] The jumper chip component B1 of the above-described firstembodiment is placed on the circuit board 5 so that it is positioned onthe second conductive pattern 7.

[0077] In this case, the shielding portion 4 a of the conductivematerial 4 is insulated from the second conductive pattern 7 by thelower rectangular plate 2. The connecting portions 3 a of the connectionconductor 3 are positioned on the first conductive patterns 6 a and 6 b,and the connecting portions 4 c of the conductive material 4 arepositioned on the third conductive patterns 8.

[0078] In the jumper chip component B1 placed on the circuit board 5 insuch a state, the connection conductor 3 is soldered to the firstconductive patterns 6 a and 6 b and the conductive material 4 issoldered to the third conductive patterns 8 with solder cream (notshown) applied on the circuit board 5.

[0079] When the jumper chip component B1 is mounted on the circuit board5, the second conductive pattern 7 and the connection conductor 3 crosseach other, and the shielding portion 4 a of the conductive material 4is interposed therebetween.

[0080] The above-described mounting structure for a jumper chipcomponent is used in, for example, a frequency conversion section,including four mixers and local oscillators thereof, for subjectinghorizontally and vertically polarized signals of radio waves sent fromtwo satellites to frequency conversion.

[0081] While a high-frequency signal passes through the secondconductive pattern 7 and the connection conductor 3, interferencetherebetween is minimized because the shielding portion 4 a of theconductive material 4 is interposed therebetween.

[0082] The configuration of a mounting structure for a jumper chipcomponent according to a sixth embodiment of the present invention willnow be described with reference to FIG. 10. A circuit board 5 on whichvarious electrical components (not shown) are mounted is provided with apair of first conductive patterns 6 a and 6 b spaced from each other, asecond conductive pattern 7 extending between the first conductivepatterns 6 a and 6 b, and a plurality of third conductive patterns 8 forgrounding, in a manner similar to that in the fifth embodiment shown inFIGS. 8 and 9.

[0083] The jumper chip component B2 of the above-described fourthembodiment is placed on the circuit board 5 so that it is positioned onthe second conductive pattern 7.

[0084] In this case, the shielding portion 14 a of the conductivematerial 14 is insulated from the second conductive pattern 7 by theinsulating film 12. The connecting portions 13 a of the connectionconductor 13 are positioned on the first conductive patterns 6 a and 6b, and the connecting portions 14 c of the conductive material 14 arepositioned on the third conductive patterns 8.

[0085] In the jumper chip component B2 placed on the circuit board 5 insuch a state, the connection conductor 13 is soldered to the firstconductive patterns 6 a and 6 b and the conductive material 14 issoldered to the third conductive patterns 8 with solder cream (notshown) applied on the circuit board 5.

[0086] When the jumper chip component B2 is mounted on the circuit board5, the second conductive pattern 7 and the connection conductor 13 crosseach other, and the shielding portion 14 a of the conductive material 14is interposed therebetween.

[0087] The above-described mounting structure for a jumper chipcomponent is used in, for example, a frequency conversion section,including four mixers and local oscillators thereof, for subjectinghorizontally and vertically polarized signals of radio waves sent fromtwo satellites to frequency conversion.

[0088] While a high-frequency signal passes through the secondconductive pattern 7 and the connection conductor 13, interferencetherebetween is minimized because the shielding portion 14 a of theconductive material 14 is interposed therebetween.

[0089] The configuration of a mounting structure for a jumper chipcomponent according to a seventh embodiment of the present inventionwill now be described with reference to FIG. 11. A circuit board 5 onwhich various electrical components (not shown) are mounted is providedwith three pairs of first conductive patterns 6 a and 6 b spaced fromeach other, a second conductive pattern 7 extending between the firstconductive patterns 6 a and 6 b, and a plurality of third conductivepatterns 8 for grounding.

[0090] The jumper chip component B1 of the above-described thirdembodiment is placed on the circuit board 5 so that it is positioned onthe second conductive pattern 7.

[0091] In this case, the shielding portion 4 a of the conductivematerial 4 is insulated from the second conductive pattern 7 by thelower rectangular plate 2. The connecting portions 3 a of the threeconnection conductors 3 are positioned on the corresponding three pairsof first conductive patterns 6 a and 6 b, and the connecting portions 4c of the conductive material 4 are positioned on the third conductivepatterns 8.

[0092] In the jumper chip component B1 placed on the circuit board 5 insuch a state, the connection conductors 3 are soldered to the threepairs of first conductive patterns 6 a and 6 b and the conductivematerial 4 is soldered to the third conductive patterns 8 with soldercream (not shown) applied on the circuit board 5.

[0093] When the jumper chip component B1 is mounted on the circuit board5, the second conductive pattern 7 and the connection conductors 3 crosseach other, and the shielding portion 4 a of the conductive material 4is interposed therebetween.

[0094] The center first conductive patterns 6 a and 6 b of the threepairs of first conductive patterns 6 a and 6 b arranged side by side areused for grounding. Therefore, the center connection conductor 3 of thethree connection conductors 3 is grounded.

[0095] For this reason, interference between the hot-side connectionconductors 3 on both sides is reduced by the center grounded connectionconductor 3.

[0096] The above-described mounting structure for a jumper chipcomponent is used in, for example, a frequency conversion section,including four mixers and local oscillators thereof, for subjectinghorizontally and vertically polarized signals of radio waves sent fromtwo satellites to frequency conversion.

[0097] While a high-frequency signal passes through the secondconductive pattern 7 and the connection conductor 3, interferencetherebetween is minimized because the shielding portion 4 a of theconductive material 4 is interposed therebetween.

[0098] While the present invention has been described with reference towhat are presently considered to be the preferred embodiments, it is tobe understood that the invention is not limited to the disclosedembodiments. On the contrary, the invention is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims. The scope of the following claims is to beaccorded the broadest interpretation so as to encompass all suchmodifications and equivalent structures and functions.

What is claimed is:
 1. A jumper chip component comprising: an insulatingsubstrate composed of a stacked rectangular plates; a connectionconductor formed of a conductive layer over an upper face and oppositeside faces of said insulating substrate; and a conductive materialformed of a conductive layer between said plates of said insulatingsubstrate and on a side face at a corner of said insulating substrate soas not to be electrically connected to said connection conductor,wherein said conductive material formed between said plates of saidinsulating substrate opposes said connection conductor formed on saidupper face of said insulating substrate.
 2. A jumper chip componentaccording to claim 1, wherein said conductive material formed on saidside face of said insulating substrate is formed at a plurality of saidcorners.
 3. A jumper chip component according to claim 2, wherein saidconductive material is formed at each of the four corners.
 4. A jumperchip component according to claim 1, wherein said conductive material isformed on the adjoining side faces. 5 A jumper chip component accordingto claim 1, wherein a cutoff portion is formed at said corner of saidinsulating substrate, and said conductive material is formed on saidside face having said cutoff portion.
 6. A jumper chip componentaccording to claim 1, wherein said connection conductor and saidconductive material extend from said side faces and said face,respectively, onto a lower face of said insulating substrate.
 7. Ajumper chip component according to claim 1, wherein at least threeconnection conductors are arranged side by side.
 8. A jumper chipcomponent comprising: a rectangular insulating substrate; a connectionconductor formed of a conductive layer over an upper face and oppositeside faces of said insulating substrate; a conductive material formed ofa conductive layer on a lower face of said insulating substrate and on aside face at a corner of said insulating substrate so as not to beelectrically connected to said connection conductor; and an insulatingfilm formed on said lower face of said insulating substrate so as tocover the surface of said conductive material, wherein said conductivematerial formed on said lower face of said insulating substrate opposessaid connection conductor formed on said upper face of said insulatingsubstrate.
 9. A jumper chip component according to claim 8, wherein saidconductive material formed on said side face of said insulatingsubstrate is formed at a plurality of said corners.
 10. A jumper chipcomponent according to claim 9, wherein said conductive material isformed at each of the four corners.
 11. A jumper chip componentaccording to claim 8, wherein said conductive material is formed on theadjoining side faces.
 12. A jumper chip component according to claim 8,wherein a cutoff portion is formed at said corner of said insulatingsubstrate, and said conductive material is formed on said side facehaving said cutoff portion.
 13. A jumper chip component according toclaim 8, wherein said connection conductor and said conductive materialextend from said side faces and said face, respectively, onto said lowerface of said insulating substrate.
 14. A jumper chip component accordingto claim 8, wherein at least three connection conductors are arrangedside by side.
 15. A mounting structure for a jumper chip component,comprising: said jumper chip component according to claim 1; and acircuit board having a conductive pattern, wherein said conductivepattern includes a pair of first conductive patterns spaced from eachother, a second conductive pattern extending between said firstconductive patterns, and a third conductive pattern for grounding, andwherein said jumper chip component is placed on said circuit board sothat a lower face of said insulating substrate of said jumper chipcomponent is positioned on said second conductive pattern, both ends ofsaid connection conductor crossing said second conductive pattern aresoldered to said pair of first conductive patterns, respectively, andsaid conductive material is soldered to said third conductive pattern.16. A mounting structure for a jumper chip component according to claim15, wherein a plurality of said third conductive patterns are provided,and said conductive material formed at said corner of said insulatingsubstrate is soldered to said third conductive patterns.
 17. A mountingstructure for a jumper chip component according to claim 15, comprising:said jumper chip component according to claim 7; and said circuit boardon which at least three pairs of first conductive patterns are arrangedside by side, wherein said three connection conductors are soldered tosaid corresponding three pairs of first conductive patterns, and thecenter pair of conductive patterns of said three pairs of firstconductive patterns are used for grounding.
 18. A mounting structure fora jumper chip component, comprising: said jumper chip componentaccording to claim 8; and a circuit board having a conductive pattern,wherein said conductive pattern includes a pair of first conductivepatterns spaced from each other, a second conductive pattern extendingbetween said first patterns, and a third conductive pattern forgrounding, and wherein said jumper chip component is placed on saidcircuit board in a state in which said insulating film of said jumperchip component is positioned on said second conductive pattern, bothends of said connection conductor crossing said second conductivepattern are soldered to said pair of first conductive patterns,respectively, and said conductive material is soldered to said thirdconductive pattern.
 19. A mounting structure for a jumper chip componentaccording to claim 18, wherein a plurality of said third conductivepatterns are provided, and said conductive material formed at saidcorner of said insulating substrate is soldered to said third conductivepatterns.
 20. A mounting structure for a jumper chip component accordingto claim 18, comprising: said jumper chip component according to claim14; and said circuit board on which at least three pairs of firstconductive patterns are arranged side by side, wherein said threeconnection conductors are soldered to said corresponding three pairs offirst conductive patterns, and the center pair of first conductivepatterns of said three pairs of first conductive patterns are used forgrounding.